Dehesive paper and film coating agents were featured by Wacker Silicones at Labelexpo Europe 2007. The company has developed “cost effective” systems which minimize the amount of platinum catalyst needed for complete cure.
For example, the new solvent free Dehesive 915 release coating is said to enable very good coverage at reduced coat weights – leading to lower release liner production costs. It has low viscosity, is readily processed and offers an extremely flat high speed release profile.
The Dehesive 960 silicone release coating system takes a different approach. Formulated with a novel polymer, it reacts far more quickly, which lowers the need for platinum complex by as much as 60 per cent compared with conventional silicone systems. Wacker says the release profile remains very low - flat, even at high delamination speeds, making this solvent free addition curing release coating particularly suitable for label applications.
Also at Labelexpo, Wacker showcased products from its high speed series: Dehesive 906 AMA and Dehesive 902 AMA, and the catalyst HSPC AMA. The 906 AMA and 902 AMA release coating systems were designed for coating speeds of over 1,000m/min. The integrated anti misting additive is said to suppress the formation of silicone aerosols and VOCs – even at rapid coating speeds - and prevents the formation of air bubbles that cause streaks in the release coating.
The catalyst HSPC AMA can be combined with virtually any solvent free Dehesive system, enabling higher coating speeds even for existing systems.
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