Thinlam is a new contactless prelaminate for RFID card and government applications from KSW Microtec. With a thickness of 280 micron, it will enable manufacturers to produce HF and UHF RFID cards with more layers, broadening the possibilities to integrate more security and other high value features, the company states.
The exceptional thinness is achieved by manufacturing the material without chip modules, which is also said to result in smoother card surfaces and better printing. High durability is also promised by the patented chip connection technology used.
In addition, due to the consistently reproducible antenna geometries, Thinlam is claimed to achieve tighter resonance frequency tolerances. It can be manufactured on PVC, polycarbonate, PET or Teslin and can also be used for transparent RFID cards.
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