Henkel Honoured with Dow Packaging Innovation Award

19 September 2019

Henkel Corporation is a Diamond Finalist in the 2019 Packaging Innovation Awards by Dow for its EPIX technology sustainable packaging solution. EPIX comprises a portfolio of materials and chemistries enhancing paper products and offering a paper packaging alternative for consumers. It expands paper functionality and improves performance while maintaining the sustainability and recyclability of the package. 

“This year Dow received a record-breaking number of submissions for innovative, forward-thinking packaging designs from around the world,” said Diego Donoso, business president for Dow Packaging & Specialty Plastics. “I’m continually impressed by the world class innovations that we see year after year. Congratulations to Henkel Corporation for helping drive the industry forward.” 

The Packaging Innovation Awards consist of three levels – Silver, Gold and Diamond. Selection is based on excellence in technological advancement, responsible packaging and enhanced user experience. All entries are reviewed and judged by an independent panel of international judges throughout the packaging value chain.

The demand for more sustainable alternatives necessitated development of technologies that enhanced paper product functionality. As a result, Henkel embarked on a programme to create functional, sustainable solutions for paper, including thermal resistance, impact resistance and barrier properties.

The key technological advance involves functionalities that are easily separated from the paper during the re-pulping process, providing for the recovery and reuse of the fiber, and aligning with Henkel’s comprehensive commitment to a circular economy for plastic and sustainable packaging. With the rise in eCommerce packaging, EPIX technology delivers an option for brands and consumers. Amazon is currently deploying the EPIX sustainable packaging technology in selected markets.



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