Flexible packaging and JDF features at Ipex 2006

8 November 2005


A flexible packaging area will be introduced at next year's Ipex show. Located in Hall 1 of the 11-hall exhibition, which runs at the NEC in Birmingham, UK, from April 4-11, 2006, it will showcase new technologies and materials for the industry. In addition, a Flexible Packaging Centre of Excellence will host customer and supplier best practice case studies.

The show will also feature a Process Automation and JDF Pavilion that will highlight user solutions for improving production interoperability, productivity and profitability. The 250m2 pavilion will be prominently positioned in Hall 20 just a few steps away from a main entrance to the event. In addition, an MIS, JDF and Software trail will indicate those exhibitors showing JDF enabled process automation products and systems.

  

Contact

Ipex 2006 Tel: + 44 (0) 20 7915 5614




External weblinks
Converting Today is not responsible for the content of external internet sites.

Ipex 2006



Privacy Policy
We have updated our privacy policy. In the latest update it explains what cookies are and how we use them on our site. To learn more about cookies and their benefits, please view our privacy policy. Please be aware that parts of this site will not function correctly if you disable cookies. By continuing to use this site, you consent to our use of cookies in accordance with our privacy policy unless you have disabled them.