Blister seal benefits

14 October 2005


Four new adhesive base resins have been developed by Scott Bader to solve the problems associated with blister seal packs and printing water based material on to non absorbent substrates.

Texicryl 17-0402 is a second generation acrylic designed to operate as the main binder in blister seal adhesive formulations which support high quality graphics. It is said to be APEO-free and also suitable for use as a modifying resin to coldseal adhesives, providing a better adhesive key to substrates, particularly absorbent-to-absorbent materials.

"The excellent flow, levelling and gloss levels achieved are compatible with quality blister packaging, with superb seal integrity." The company states. Good compatibility with other products used in compounding the special adhesives is claimed, and the product is said not to block when stacked.

Three new water based polyurethane dispersions have also been introduced - UR1000, UR1001 and UR1005 - as heat sealable paperboard coatings for blister, bubble and film. They are suitable for either in-line or off-line application requirements, for heatseal laminating absorbent board substrates to non absorbent films including PVC, PET, APET and GPET. A high gloss finish is imparted to enhance any underlying print, while low film weights only are required to achieve high bond strengths, according to Scott Bader. Non blocking qualities allow stacked storage of coated boards prior to application of blister shells, the company states.

All the polymers are said to exhibit low foaming and low odour, with good compatibility to waxes, solvents and surfactants.



Contact

Scott Bader Tel: +44 (0) 1933 663100




External weblinks
Converting Today is not responsible for the content of external internet sites.

Scott Bader



Privacy Policy
We have updated our privacy policy. In the latest update it explains what cookies are and how we use them on our site. To learn more about cookies and their benefits, please view our privacy policy. Please be aware that parts of this site will not function correctly if you disable cookies. By continuing to use this site, you consent to our use of cookies in accordance with our privacy policy unless you have disabled them.